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WEI Meng fu, XIAN Xiao bin, LIU Ji dong(China Academy of Physical Engineering, Mianyang 621900, China). Testing of Al Plating Thickness on U Matrix by EDXRF[J]. Atomic Energy Science and Technology, 2000, 34(S1): 53-53. DOI: 10.7538/yzk.2000.34.S1.0053
Citation: WEI Meng fu, XIAN Xiao bin, LIU Ji dong(China Academy of Physical Engineering, Mianyang 621900, China). Testing of Al Plating Thickness on U Matrix by EDXRF[J]. Atomic Energy Science and Technology, 2000, 34(S1): 53-53. DOI: 10.7538/yzk.2000.34.S1.0053
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  • The interaction of X ray between Al plating and U matrix materials, the effect of U matrix's radioactivity to measurement of Al thickness has been discussed. A mathematical model of the relationship between intensity and plating thickness has been advanced, as well as in the same model, U M and U L ray are selected to measure thin and thick sample, respectively. Nondestructive testing method of Al plating thickness on U matrix has been found by measurement microarea on the working sample using collimating technology, and carrying out Least Square Regressing Analysis for the result of measurement.
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