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XIE Jun, WU Wei-dong, DU Kai, ZHENG Feng-cheng,YE Cheng-gang, HUANG Li-zhen, YUAN Guang-hui(Research Center of Laser Fusion, China Academy of Engineering Physics, P. O. Box 919-987, Mianyang 621900, China). Process and Microstructure Analysis in Vacuum Diffusion Bonding of Aluminum and Copper Films[J]. Atomic Energy Science and Technology, 2004, 38(S1): 120-120. DOI: 10.7538/yzk.2004.38.S1.0120
Citation: XIE Jun, WU Wei-dong, DU Kai, ZHENG Feng-cheng,YE Cheng-gang, HUANG Li-zhen, YUAN Guang-hui(Research Center of Laser Fusion, China Academy of Engineering Physics, P. O. Box 919-987, Mianyang 621900, China). Process and Microstructure Analysis in Vacuum Diffusion Bonding of Aluminum and Copper Films[J]. Atomic Energy Science and Technology, 2004, 38(S1): 120-120. DOI: 10.7538/yzk.2004.38.S1.0120
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  • By using vacuum diffusion bonding process, the microstructure and performance of diffusion transition zone for the Al/Cu films diffusion bonding joint were researched by means of SEM and XRD. The results indicate that under the condition of heating temperature 250 ℃, holding time 30 min and pressure force 5 MPa, diffusion interface is produced between copper and aluminum, the width of the diffusion transition zone is less than 150 nm.
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