Electroless Plating Technology of Integral Hohlraum Cu Target

LIU Ji-guang~1, WAN Xiao-bo~2, FU Qu~1, ZHOU Lan~2, XIAO Jiang~2 (1.Southwest University of Science and Technology, Mianyang 621010, China; 2.Research Center of Laser Fusion, Chinese Academy of Engineering Physics, P.O. Box 919-988, Mianyang 621900, China)

doi:10.7538/yzk.2005.39.01.0077

Atomic Energy Science and Technology > 2005 > 39(1): 77-77. > DOI: 10.7538/yzk.2005.39.01.0077

LIU Ji-guang~1, WAN Xiao-bo~2, FU Qu~1, ZHOU Lan~2, XIAO Jiang~2 (1.Southwest University of Science and Technology, Mianyang 621010, China; 2.Research Center of Laser Fusion, Chinese Academy of Engineering Physics, P.O. Box 919-988, Mianyang 621900, China). Electroless Plating Technology of Integral Hohlraum Cu Target[J]. Atomic Energy Science and Technology, 2005, 39(1): 77-77. DOI: 10.7538/yzk.2005.39.01.0077

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Electroless Plating Technology of Integral Hohlraum Cu Target

LIU Ji-guang~1, WAN Xiao-bo~2, FU Qu~1, ZHOU Lan~2, XIAO Jiang~2 (1.Southwest University of Science and Technology, Mianyang 621010, China; 2.Research Center of Laser Fusion, Chinese Academy of Engineering Physics, P.O. Box 919-988, Mianyang 621900, China)

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Received Date: February 01, 2004

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The electroless plating method of making integral hohlraum Cu target and corrosion-resistant technology of target’s surface were researched. The actual process was as follows, choosing plexiglass(PMMA) as arbor, taking cationic activation and electroless plating Cu on the arbor surface, taking arbor surface passivation and chemical etching by C_6H_5N_3 solution. The technology is easy to realize and its cost is lower, so it is of great reference value for fabricating other integral hohlraum metal or alloy targets used for inertial confinement fusion study.
- inertial confinement fusion,
- Cu target,
- electroless plating,
- surface passivation

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Electroless Plating Technology of Integral Hohlraum Cu Target

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