LIAO Guo, HE Zhi-bing, CHEN Tai-hong, XU Hua, LI Jun, CHEN Jia-jun. Effect of Sputtering Power on Structure and Properties of Bi Film Deposited by DC Magnetron Sputtering[J]. Atomic Energy Science and Technology, 2012, 46(6): 749-753. DOI: 10.7538/yzk.2012.46.06.0749
Citation: LIAO Guo, HE Zhi-bing, CHEN Tai-hong, XU Hua, LI Jun, CHEN Jia-jun. Effect of Sputtering Power on Structure and Properties of Bi Film Deposited by DC Magnetron Sputtering[J]. Atomic Energy Science and Technology, 2012, 46(6): 749-753. DOI: 10.7538/yzk.2012.46.06.0749

Effect of Sputtering Power on Structure and Properties of Bi Film Deposited by DC Magnetron Sputtering

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  • Received Date: December 31, 1899
  • Revised Date: December 31, 1899
  • Bi film was fabricated at different sputtering powers by DC magnetron sputtering. The deposition rate of Bi film as the function of sputtering power was studied. The surface topography of Bi film was observed by SEM, and the growth mode of Bi film was investigated. The crystal structure was analyzed by XRD. The grain size and stress of Bi film were calculated. The SEM images show that all the films are columnar growth. The average grain size firstly increases as the sputtering power increases, then decreases at 60 W. The film becomes loose with the increase of sputtering power, while, the film gets compact when the sputtering power becomes from 45 to 60 W. The XRD results show that films are polycrystalline of hexagonal. And the stress transforms from the tensile stress to compressive stress as the sputtering power increases.
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