Heat Load Analysis of CM4 Cryomodule for C-ADS Main Linac

In order to optimize the structure of CM4 cryomodule, the sources of heat load of the cryomodule were analyzed, such as the heat conduction of POST, current leads and high power coupler, the heat radiation of 80 K shield, and the dynamic heat load of superconducting cavity and high power coupler. The results show that the CM4 cryomodule satisfies the needs of low heat load, and it provides important theory foundation of optimization and commissioning.