聚乙烯膜对样品残余应力测试的影响

Residual Stress Measurement of the Specimen With the Mylar Film by X-ray Diffraction

  • 摘要: 采用X2 0 0 1应力分析仪测试了α Fe和铍样品表面分别覆盖聚乙烯膜前后的残余应力, 探讨了残余应力测试值变化的原因及其规律。样品表面覆盖聚乙烯膜后, 由于校准距离D的增大, 使得衍射峰向低角度方向偏移, 从而引起应力实测值发生了改变。通过对应力实测值进行修正, 可获得样品内的真实应力。

     

    Abstract: The residual stresses of α Fe and beryllium specimen surface with and without the Mylar film are measured by X2001 stress analyzer. The reason and the regulation of the measured residual stress change are discussed. The results show that the increasement of the calibration distance D for the specimen surface with the Mylar film shiftes the diffraction peak to the lower angle, thus changing the measured value of residual stress. The real residual stress of specimen can be obtained by correcting the measured value of residual stress.

     

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