Abstract: It is less complicated to make a simple material structure by the combination of IBED transition layer and EBD copper film than to make a multi layer Ti Cu film by EBD.Moreover, the combination of IBED and EBD wouldn't make the next process of photo etching more difficult than EBD. Favorable adhesion can be realized by depositing copper film on the alumina ceramics that has low surface roughness( Ry ≤0.1 μm). Experiments show that the method using the IBED transition copper layer combined with EBD copper film is the best technology among the film fabrication technologies popularly used at present.