热处理和添加Cu对SiC-C涂层与基体混合效应的影响

曾俊辉, 杜良, 张东, 杜纪富, 杨淑勤, 黄宁康

曾俊辉, 杜良, 张东, 杜纪富, 杨淑勤, 黄宁康. 热处理和添加Cu对SiC-C涂层与基体混合效应的影响[J]. 原子能科学技术, 2009, 43(1): 67-70. DOI: 10.7538/yzk.2009.43.01.0067
引用本文: 曾俊辉, 杜良, 张东, 杜纪富, 杨淑勤, 黄宁康. 热处理和添加Cu对SiC-C涂层与基体混合效应的影响[J]. 原子能科学技术, 2009, 43(1): 67-70. DOI: 10.7538/yzk.2009.43.01.0067
ZENG Jun-hui, DU Liang, ZHANG Dong, DU Ji-fu, YANG Shu-qing, HUANG Ning-kang. Effects of Thermal Treatment and Cu Join on Mixing Degree of SiC-C Coatings and Substrates[J]. Atomic Energy Science and Technology, 2009, 43(1): 67-70. DOI: 10.7538/yzk.2009.43.01.0067
Citation: ZENG Jun-hui, DU Liang, ZHANG Dong, DU Ji-fu, YANG Shu-qing, HUANG Ning-kang. Effects of Thermal Treatment and Cu Join on Mixing Degree of SiC-C Coatings and Substrates[J]. Atomic Energy Science and Technology, 2009, 43(1): 67-70. DOI: 10.7538/yzk.2009.43.01.0067

热处理和添加Cu对SiC-C涂层与基体混合效应的影响

详细信息
  • 中图分类号: O484.1

Effects of Thermal Treatment and Cu Join on Mixing Degree of SiC-C Coatings and Substrates

  • 摘要: 在不锈钢基体上用离子束混合技术沉积SiC-C涂层,为有效提高SiC-C涂层与不锈钢基体元素的混合效应,采用涂覆后对样品进行加热处理以及在不锈钢基体上预沉积Cu薄膜的方法,试图改善SiC-C涂层与基体的混合效果。通过二次离子质谱(SIMS)测试分析涂层与基体的界面组份分布。结果表明,加热处理可以提高SiC-C涂层组元向基体的内扩散,但效果不甚显著。添加Cu层以及随后的加热处理可极大提高与不锈钢基体的混合程度。

     

    Abstract: SiC-C coatings were deposited on stainless steel substrates using ion beam mixing. In order to improve the element intermixing effect on the coatings and the substrates, thermal treatment and the addition of Cu were used. Secondary ion mass spectroscopy analysis was used to characterize the element distributions for the transition layer between SiC-C coatings and substrates. The diffusion of elements from the coating into substrate happened due to thermal treatment, but its effect on widening the transition layer between C-SiC coating and Fe substrate for the samples of the C-SiC coating on stainless steel substrate is not significant. But, Cu addition and the following thermal treatment can effectively enhance element mixing between the coatings and the substrates.

     

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出版历程
  • 收稿日期:  2007-08-19
  • 修回日期:  2007-10-31
  • 刊出日期:  2009-01-19

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