Abstract: Combining the mathematical regression analysis with the physical stressing experiment, the non-destructive screening method for radiation hardened performance of integrated circuit was investigated. The relationship between the change of typical parameters and the radiation performance of the circuit was discussed. The sensitive parameters to irradiation were confirmed. The pluralistic linear regression equation for the prediction of the radiation performance was established. Finally, the regression equations under stress conditions were verified by practical irradiation. The results show that the reliability of the non-destructive screening method can be improved by combining the mathematical regression analysis with the practical stressing experiment.