强流溅射源束流杂质的分析和消除

Analysis and Elimination of Ion Beam Impurity for Intensive Sputter Source

  • 摘要: 在北京HI-13串列加速器上使用强流溅射源引出某些离子时,总是含有不必要的束流杂质。经详细分析后确定束流杂质主要是由离子源内部一个绝缘套筒造成的。本文对离子源内部结构进行了改进:在靶阴极与阳极之间的绝缘套筒上加上内外金属屏蔽帽,从而降低了束流杂质,提高了束流的纯度和强度。

     

    Abstract: At Beijing HI-13 Tandem Accelerator the high intensive sputter source is used to extracting ion beam, but there are some kinds of beam impurities. After detailed analysis it is found that the beam impurities are caused by inside source insulation bushing. The inner structure of the source was improved with metal shields fixed inside and outside of the insulation bushing between the cathode and the anode. After the improvement, beam impurities from the intensive sputter source decrease and the purity and intensity of the needed beams increase.

     

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