14 nm FinFET器件单粒子瞬态特性研究

Characterization of Single Event Transient in 14 nm FinFET Technology

  • 摘要: 为评估鳍式场效应晶体管(FinFET)的本征抗辐射能力,本文通过三维工艺计算机辅助设计(TCAD)仿真研究了14 nm FinFET工艺的单粒子瞬态(SET)特性。研究结果表明,在不同的线性能量传输(LET)值及不同的入射位置下,FinFET器件具有不同的单粒子敏感性。SET脉冲宽度随LET值的增大而展宽。此外,SET特性与粒子轰击位置的关系呈现出复杂性。对于低LET值(LET≤1 MeV·cm2/mg),SET特性与重离子的入射位置具有很强的依赖性;对于高LET值(LET>10 MeV·cm2/mg),由于加强了衬底的电荷收集,SET特性与粒子轰击位置的依赖性减弱。

     

    Abstract: In order to evaluate the intrinsic radiation hardness of the fin field effect transistor (FinFET) device, the characteristics of single event transient (SET) were studied by 3D technology computeraided design (TCAD) simulations in the 14 nm FinFET technology. The results show that the singleevent sensitivity varies according to LET values and incident positions. The width of SET pulse broadens with the increase of LET values. Besides, the response of SET has a complicated relationship with the strike location. For lowLET values (LET≤1 MeV·cm2/mg), the SET response has a strong dependency on the place where it is struck by heavy ions. For highLET values (LET>10 MeV·cm2/mg), the strike location dependency of the SET response diminishes due to the enhanced substrate charge collection.

     

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